Development of Sputtering Sources for Unique Applications
The primary goal of this program is to design, fabricate, and characterize unique sputtering sources for thin films and nanoparticles synthesis. We have developed a unique split cathode cylindrical magnetron that is capable of depositing insulating materials at extremely high rates. The high rates are associated with the geometry of the source which confines the plasma close to the target surface without the need of a confining magnetic field. We have used these sources to deposit Al2O3 and TiO2 thin films and nanoparticles.
"Reactive sputter deposition of alumina thin films using a hollow cathode sputtering source" Anshu A. Pradhan, S. Ismat Shah and Karl M. Unruh, Rev. Sci. Instrum., 73 3841 (2002).
"High Deposition Rate Reactive Sputtering with Hollow Cathode" Anshu A. Pradhan and S. Ismat Shah, Proceedings of the Annual SVC Technical Conference (2002), p.96
"Static Mode Hollow Cathode Reactive Sputtering" Anshu A. Pradhan and S. Ismat Shah, Proceedings of the Annual SVC Technical Conference (2003). (in press)